14-Layer Rigid-Flex PCB – Built on R-F777 Polyimide and S1000-2M FR-4 for High-Density Robotic Solutions
(FPC’s are custom-made products, the picture and parameters shown are just for reference)
In the realm of advanced electronics, the 14-Layer Rigid-Flex PCB is a state-of-the-art solution designed for high-density interconnection, dynamic bending, and complex spatial layouts. Combining the flexibility of Panasonic R-F777 Polyimide with the rigidity of S1000-2M FR-4, this PCB is engineered to meet the demands of high-reliability applications in industrial automation, medical equipment, automotive electronics, and aerospace.
Key Features of 14-Layer Rigid-Flex PCB
1.High-Density Integration and Ultra-Thin Design:
Rigid board thickness: 2.0mm (green solder mask with white silkscreen).
Flexible board thickness: 0.21mm (yellow coverlay with white silkscreen), enabling dynamic bending with a bending radius ≤ 3mm.
Symmetrical 14-layer stack-up design (including 2 flexible layers) ensures signal integrity and mechanical stability.
2.High-Precision Impedance Control:
Impedance tolerance: ±10%, optimized for high-frequency signal transmission, making it ideal for high-speed communication modules and precision sensors.
Copper thickness: Inner layer 0.5oz, outer layer 1oz, ensuring optimal current carrying capacity and heat dissipation.
3.High-Reliability Surface Treatment:
Immersion gold process: Surface immersion gold thickness ≥ 3μ", enhancing soldering reliability, oxidation resistance, and extending the PCB's service life.
Flexible base material: Panasonic R-F777 polyimide, resistant to high temperatures (Tg ≥ 260℃) and fatigue from bending.
4.Strict Quality Control:
Inspection standard: Meets IPC-A-600 Class 3 requirements, ensuring military-grade reliability.
Traceability: Supports serial number printing for easy production tracking and quality traceability.
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Detailed Technical Parameter Table
| Size of Flex-Rigid PCB | 238mm x 42mm=1 PCS | ||
| Number of Layers | 14 | ||
| Board Type | Rigid-Flex PCB | ||
| Board Thickness | 2.0mm -Rigid, 0.21mm - flex | ||
| Board Material | FR-4 / Polyimide 3mil | ||
| Board Material Supplier | Shengyi / Panasonic | ||
| Tg Value of Board Material | 170℃ | ||
| PTH Cu thickness | ≥20 µm | ||
| Inner Iayer Cu thicknes | 18 µm | ||
| Surface Cu thickness | 35 µm | ||
| Coverlay Colour | Yellow coverlay / Green solder mask | ||
| Number of Coverlay | 2 | ||
| Thickness of Coverlay | 25 µm | ||
| Stiffener Material | N/A | ||
| Stiffener Thickness | N/A | ||
| Type of Silkscreen Ink | IJR-4000 MW300 | ||
| Supplier of Silkscreen | TAIYO | ||
| Color of Silkscreen | White | ||
| Number of Silkscreen | 1 | ||
| Peeling test of Coverlay | No peelable | ||
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test | ||
| Surface Finish | Immersion Gold | ||
| Thickness of Surface Finish | Au: 0.03µm(Min.); Ni 2-4µm | ||
| RoHS Required | Yes | ||
| Famability | 94-V0 | ||
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. | ||
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. | ||
| Function | 100% Pass electrical test | ||
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 3 | ||
| Impedance Control | Required impedance, Ohm | Layer | Reference layer |
| Single ended impedance (Z0) 40±10% | TOP | IN1 | |
| IN3 | IN2/IN4 | ||
| IN6 | IN5/IN7 | ||
| IN8 | IN7/IN9 | ||
| IN10 | IN9/IN11 | ||
| BOT | IN12 | ||
| Single ended impedance (Z0) 50±10% | TOP | IN1 | |
| IN3 | IN2/IN4 | ||
| IN6 | IN5/IN7 | ||
| IN8 | IN7/IN9 | ||
| BOT | IN12 | ||
| Single ended impedance (Z0) 50±10% | IN6 (flex part) | IN7 (flex part) | |
| Differential impedance (Zdiff) 80±10% | TOP | IN1 | |
| IN3 | IN2/IN4 | ||
| IN8 | IN7/IN9 | ||
| IN10 | IN9/IN11 | ||
| Differential impedance (Zdiff) 100±10% | TOP | IN1 | |
| IN3 | IN2/IN4 | ||
| IN6 | IN5/IN7 | ||
| BOT | IN12 | ||
| Differential impedance (Zdiff) 100±10% | IN6 (flex part) | IN7 (flex part) | |
Applications
The 14-Layer Rigid-Flex PCB is ideal for a wide range of high-reliability applications, including:
Industrial Automation: Control modules for robotic arms and high-precision sensor interconnections.
Medical Electronics: Flexible circuits for endoscopes and portable monitoring devices.
Automotive Electronics: Onboard cameras and high-speed signal transmission in ADAS (Advanced Driver Assistance Systems).
Consumer Electronics: Folding screen devices and miniaturized smart wearable products.
Why Choose 14-Layer Rigid-Flex PCB?
Superior Flexibility and Rigidity: The combination of R-F777 Polyimide and S1000-2M FR-4 ensures the PCB can withstand dynamic bending while maintaining structural stability.
High Signal Integrity: Advanced impedance control and symmetrical stack-up design ensure efficient and stable signal transmission.
Military-Grade Reliability: Manufactured to IPC-A-600 Class 3 standards, the PCB undergoes rigorous testing to ensure the highest level of reliability.
Customizable Design: Supports small-batch customization and mass production, tailored to meet specific application requirements.
Fast Delivery: Prototype and production cycles are optimized to meet tight deadlines without compromising quality.
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Quality Control and Testing
Production Control: Laser drilling and LDI (Laser Direct Imaging) exposure processes ensure the accuracy of micro vias (3mil base material).
Testing Support: Impedance test reports and AOI/X-ray inspection data are provided to ensure quality and reliability.
Delivery Form: Single pieces are individually packaged (238 × 42mm), supporting both small-batch customization and mass production.
Conclusion
The 14-Layer Rigid-Flex PCB is a high-performance, reliable solution designed for applications requiring both flexibility and rigidity. With its advanced materials, precise impedance control, and military-grade reliability, it is an ideal choice for engineers working on robotic solutions, medical devices, automotive electronics, and consumer electronics.
Whether you're designing for high-density interconnection or dynamic bending applications, the 14-Layer Rigid-Flex PCB offers the reliability and performance you need to bring your projects to life.